Author:
Lee Hyunseong,Koo Bonsung,Chattopadhyay Aditi,Neerukatti Rajesh Kumar,Liu Kuang C.
Subject
Computer Science Applications,Mechanical Engineering,Aerospace Engineering,Civil and Structural Engineering,Signal Processing,Control and Systems Engineering
Reference39 articles.
1. Digital integrated circuits: a design perspective;Rabaey,2003
2. Design of Practical Liquid Metal Cooling Device for Heat Dissipation of High Performance CPUs;Deng;J. Electron. Packag.,2010
3. Fundamental Study of Polymer to Metal Bonding in Integrated Circuit Packaging, in;Thanu,2018
4. Electronic packaging materials and their properties;Pecht,1998
5. Study on the Die-Attach Voids Distribution With X-Ray and Image Processing Techniques;Sesek;J. Electron. Packag.,2019
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