Study on the Die-Attach Voids Distribution With X-Ray and Image Processing Techniques-Reference-Cited by-同舟云学术

Study on the Die-Attach Voids Distribution With X-Ray and Image Processing Techniques

Published:2019-03-04 Issue:2 Volume:141 Page:
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Sesek Aleksander¹,Chambers Olga¹,Trontelj Janez²

Affiliation:

1. Laboratory of Microelectronics, Department of Microelectronic Technology, Faculty of Electrical Engineering, University of Ljubljana Slovenia, Ljubljana 1000, Slovenia e-mail:

2. Professor Laboratory of Microelectronics, Department of Microelectronic Technology, Faculty of Electrical Engineering, University of Ljubljana Slovenia, Ljubljana 1000, Slovenia e-mail:

Abstract

Power electronic components' reliability depends, to a great extent, on the quality of die-attach technology. The voids appearance in the die-attach regions is almost unavoidable during the manufacturing process. The aim of this paper is to demonstrate that image processing tools enable fast and accurate void segmentation, while reducing manual interaction for X-ray monitoring of imperfect power transistor die soldering. The most common void parameters such as void area, void distribution, and shape roundness were extracted and used for statistical analysis.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/doi/10.1115/1.4042804/6143338/ep_141_02_021005.pdf

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