Shock and Vibration of Solder Bumped Flip Chip on Organic Coated Copper Boards-Reference-Cited by-同舟云学术

Shock and Vibration of Solder Bumped Flip Chip on Organic Coated Copper Boards

Published:1996-06-01 Issue:2 Volume:118 Page:101-104
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Lau John¹,Schneider Eric²,Baker Tom²

Affiliation:

1. Express Packaging Systems, Inc., 1137-B San Antonio Rd, Palo Alto, CA 94303

2. Hewlett-Packard Company, 113111 Chinden Blvd, Boise, ID 83714

Abstract

The reliability of solder bumped flip chips on organic coated copper (OCC) printed circuit board (PCB) has been studied by shock and vibration tests and a mathematical analysis. Two different chip sizes (7 mm and 14 mm on a side) have been studied, and the larger chips have many internal solder bumps. For the in-plane and out-of-plane and out-of-plane shock tests, the chips were assembled with and without underfill encapsulants. However, for the out-of-plane vibration tests all the chips were underfilled with epoxy.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/118/2/101/5582433/101_1.pdf

Reference23 articles.

1. Lau, J. H., Flip Chip Technologies, McGraw-Hill, New York, NY, 1996.

2. Lau, J. H., Ball Grid Array Technology, McGraw-Hill, New York, NY, 1995.

3. Lau, J. H., Chip On Board Technologies for Multichip Modules, Van Nostrand Reinhold, Feb. 1994.

4. Lau, J. H., Handbook of Fine Pitch Surface Mount Technology, Van Nostrand Reinhold, New York, NY, 1993.

5. Lau, J. H., Handbook of Tape Automated Bonding, Van Nostrand Reinhold, New York, NY, 1992.

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