Handbook of Fine Pitch Surface Mount Technology-Reference-Cited by-同舟云学术

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Handbook of Fine Pitch Surface Mount Technology

Published:1994 Issue: Volume: Page:
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Author:

Lau John H.

Publisher

Springer US

Link

http://link.springer.com/content/pdf/10.1007/978-1-4684-1437-0.pdf

Cited by 20 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Fan-Out Technology;Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology;2024

2. Chiplets Lateral Communications;Chiplet Design and Heterogeneous Integration Packaging;2023

3. PROCESS PLANNING FOR AREA ARRAY COMPONENT ASSEMBLY;Proceeding of Flexible Automation and Integrated Manufacturing 1998;2023

4. Recent Advances and Trends in Advanced Packaging;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-02

5. System-in-Package (SiP);Semiconductor Advanced Packaging;2021

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