A Simulated Annealing-Based Approach to Three-Dimensional Component Packing-Reference-Cited by-同舟云学术

A Simulated Annealing-Based Approach to Three-Dimensional Component Packing

Published:1995-06-01 Issue:2A Volume:117 Page:308-314
ISSN:1050-0472
Container-title:Journal of Mechanical Design
language:en
Short-container-title:

Author:

Szykman S.¹,Cagan J.¹

Affiliation:

1. Department of Mechanical Engineering, Carnegie Mellon University, Pittsburgh, PA 15213

Abstract

This paper introduces a simulated annealing-based approach to three-dimensional component packing that employs simulated annealing to generate optimal solutions. Simulated annealing has been used extensively for two-dimensional layout of VLSI circuits; this research extends techniques developed for two-dimensional layout optimization to three-dimensional problems which are more representative of mechanical engineering applications. This research also provides a framework in which to solve general component layout problems.

Publisher

ASME International

Subject

Computer Graphics and Computer-Aided Design,Computer Science Applications,Mechanical Engineering,Mechanics of Materials

Link

http://asmedigitalcollection.asme.org/mechanicaldesign/article-pdf/117/2A/308/5668286/308_1.pdf

Reference25 articles.

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2. Coffman, E. G., Jr., Garey, M. R., and Johnson, D. S., 1984, “Approximation Algorithms for Bin-Packing—An Updated Survey,” Algorithm Design for Computer System Design, Ausiello, G., M. Lucertini and P. Serafini, eds., Springer-Verlag, New York, pp. 49–106.

3. Cohn J. M. , GarrodD. J., RutenbarR. A., and CarleyL. R., 1991, “KOAN/ANGRAM II: New Tools for Device-Level Analog Placement and Routing,” IEEE Journal of Solid-State Circuits, Vol. 23, No. 3, pp. 330–342.

4. Corcoran, III, A. L., and Wainwright, R. L., 1992, “A Genetic Algorithm for Packing in Three Dimensions,” Applied Computing: Technological Challenges of the 1990’s—Proceedings of the 1992 ACM/SIGAPP Symposium on Applied Computing, Kansas City, KS, pp. 1021–1030.

5. Dowsland K. A. , and DowslandW. B., 1992, “Packing Problems,” European Journal of Operational Research, Vol. 56, pp. 2–14.

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