Energy Approach to the Fatigue of 60/40 Solder: Part II— Influence of Hold Time and Asymmetric Loading
Author:
Affiliation:
1. GE R&D Center, PO Box 8, K1-139MB, Schenectady, NY 12301
2. University of Erlangen, Erlangen Germany
Publisher
ASME International
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Link
http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/118/2/67/5582512/67_1.pdf
Reference8 articles.
1. Solomon H. D. , and TolksdorfE. D., 1995, ASME Journal of Electronic Packaging, Vol. 117, pp. 130–136.
2. Coffin F. , 1954, Trans. ASME, Vol. 76, pp. 931–950.
3. Manson, S. S., 1952, “Behavior of Materials Under Conditions of Thermal Stress,” Heat Transfer Symposium, Univ of Michigan, June 27–28, Univ. of Mich. Press; also NACA TN2933, July 1953.
4. Manson S. S. , 1960, Mech. Des., Vol. 32 (14), pp. 139–144.
5. Coffin, L. F., Jr., 1969, “Predictive Parameters and their Application to High Temperature Low Cycle Fatigue.” Fracture, Proc. of Second International Conf. on Fatigue 1969, Chapman and Hall, London, pp. 643–654.
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