Author:
Kuang Jao-hwa,Hsu Chao-ming,Lin Ah-der
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Ceramics and Composites,Control and Systems Engineering,Electronic, Optical and Magnetic Materials
Reference16 articles.
1. Review of Models and the Disturbed State Concept for Thermomechanical Analysis in Electronic Packaging
2. Fatigue of 60/40 Solder
3. D. Frear, H. Morgan, S. Burchett, J. Lau, (1994),The Mechanics of Solder Alloy Interconnects, Van Nostrand Reinhold, New York, USA, pp.199–313.
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