Development of Reliability and Moldability on Fine Pitch Ball Grid Array by Optimizing Materials-Reference-Cited by-同舟云学术

Development of Reliability and Moldability on Fine Pitch Ball Grid Array by Optimizing Materials

Published:2000-08-08 Issue:1 Volume:123 Page:88-94
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Aihara Takashi¹,Ito Shingo¹,Sasajima Hideaki¹,Oota Ken¹

Affiliation:

1. Electronic Device Materials Research Laboratory, Sumitomo Bakelite Co., LTD., 20-7 Kiyohara Industrial Park Utsunomiya-City, Tochigi 321-3231, Japan

Abstract

The market for BGA packages is expanding all over the world, owing to the ease of its mounting onto the PC boards. On the other hand, BGA packages possess certain shortcomings compared to QFPs. Anti-solder crack performance on Fine Pitch BGA (=FPBGA) and warpage on Mold Array Package-BGA(=MAP-BGA) are significant disadvantages. To improve the performance of BGA packages, we studied various combinations of materials used for BGA package including molding compounds, die attach pastes, and substrates.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/123/1/88/5578073/88_1.pdf

Reference2 articles.

1. Minjin, K., Myungwhan, K., Dongsuk, S., Yongjoon, P., Myungsun, M., and Inhee, L., 1997, “Investigation on the Effect of Molding Compounds On Package Delamination,” IEEE 47th Electronic Components & Technical Conference, pp. 1242–1247.

2. Yong, T., Ee, W., and Thiam, L., 1998, “Enhancing Moisture Resistance of PBGA,” IEEE 48th Electronic Components & Technical Conference, pp. 930–935.

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