Application of the axiomatic design methodology to the design of PBGA package with polyimide coating layer
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering
Link
http://link.springer.com/content/pdf/10.1007/BF02990372.pdf
Reference24 articles.
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3. Ahn, S. H. and Kwon, Y. S., 1995, “Popcorn Phenomena in a Ball Grid Array Package,”IEEE Trans, on Components, Packaging, and Manufacturing Technology-Part B, Vol. 18, pp. 491–495.
4. Egan, E., Kelly, G. and Herard, L., 1999, “PBGA Warpage and Stress Prediction for Efficient Creation of the Thermomechanical Design Space for Package-Level Reliability,”Proc. 49 th Electronic Components and Technology Conference, ECTC 99, San Diego, pp. 1217–1223.
5. Gunasekera, J. S. and Ali, A. F., 1995, “A Three-Step Approach to Designing a Metal-Forming Process,” JOM, Vol. 47, pp. 22–25.
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