PBGA warpage and stress prediction for efficient creation of the thermomechanical design space for package-level reliability-Reference-Cited by-同舟云学术

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PBGA warpage and stress prediction for efficient creation of the thermomechanical design space for package-level reliability

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Container-title:1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299)
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Author:

Egan E.,Kelly C.,Herard L.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/6297/16841/00776384.pdf?arnumber=776384

Cited by 19 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The Influence of Properties of Solder Joint on the Stress of Underfill in Flip Chip Package;2022 IEEE 5th International Conference on Electronics Technology (ICET);2022-05-13

2. Correlation of Warpage Distribution With the Material Property Scattering for Warpage Range Prediction of PBGA Components;Journal of Electronic Packaging;2018-09-10

3. Determination of a Meaningful Warpage Acceptance Criterion for Large PBGA Components Through the Correlation with Scattering in Material Properties;2018 IEEE 68th Electronic Components and Technology Conference (ECTC);2018-05

4. Augmented materials: spatially embodied sensor networks;International Journal of Communication Networks and Distributed Systems;2013

5. A FEM study on thermal stress of PTHs in a PBGA package;Metals and Materials International;2007-08

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