The Influence of Properties of Solder Joint on the Stress of Underfill in Flip Chip Package-Reference-Cited by-同舟云学术

The Influence of Properties of Solder Joint on the Stress of Underfill in Flip Chip Package

Published:2022-05-13 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 5th International Conference on Electronics Technology (ICET)
language:
Short-container-title:

Author:

Li Chenglong¹,Zhong Cheng²,Jiang Ruoyu³,Li Yulong⁴,Chen Mingxiang⁵,Lu Jibao¹,Sun Rong¹

Affiliation:

1. Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Science,Shenzhen,China,518055

2. Huazhong University of Science and Technology,School of Mechanical Science and Engineering,Shenzhen,China,518055

3. Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Science,Shenzhen,China

4. University of Science and Technology of China,Suzhou,China

5. Huazhong University of Science and Technology,School of Mechanical Science and Engineering,Wuhan,China

Funder

National Natural Science Foundation of China

Youth Innovation Promotion Association

Publisher

IEEE

Link

Reference19 articles.

2. The effect of underfill and underfill delamination on the thermal stress in flip-chip solder joints;rzepka;Transactions of the ASME,1998