Simulative Analysis on Factors Influencing Solder Joint Bridging of Fine Pitch Devices
Author:
Yu Li Ming1, Sur Bang Han1, Pyo Kim Young1, Qing Wang Chun2, Lei Zhang2
Affiliation:
1. Department of Naval Architecture and Ocean Engineering, Chosun University, Guangju 501-759, Korea 2. State Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology, Harbin 150001, P.R. China
Abstract
Solder bridging is one of the most serious defects of solder joint in fine pitch device assemblies. It is known that the generation of solder bridging is closely related to the forming process of solder joints. To simulate the process, a 3D model is formed. Then it is numerically simulated using Surface Evolver program. Based on the results, the solder bridging mechanism and the effective factors including wetting angle and surface tension are investigated.
Publisher
ASME International
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Reference7 articles.
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