A thermodynamics model for solder profile evolution-Reference-Cited by-同舟云学术

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A thermodynamics model for solder profile evolution

Published:2000-02 Issue:4 Volume:48 Page:863-874
ISSN:1359-6454
Container-title:Acta Materialia
language:en
Short-container-title:Acta Materialia

Author:

Gao Y.X.,Fan H.,Xiao Z.

Publisher

Elsevier BV

Subject

Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials

Reference26 articles.

1. The Mechanics of Solder Alloy Wetting and Spreading;Hampshire,1993

2. The Mechanics of Solder Alloy Interconnects;Heinrich,1994

3. Equilibrium Capillary Surface;Finn,1986

4. CBGA Solder Fillet Shape Prediction and Design Optimization

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4. Experimental evaluation of wetting dynamics models for Sn63Pb37 and SnAg4.0Cu0.5 solder materials;Journal of Applied Physics;2008-08

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