Experimental Investigation of the Formation of Surface Mount Solder Joints-Reference-Cited by-同舟云学术

Experimental Investigation of the Formation of Surface Mount Solder Joints

Published:1996-12-01 Issue:4 Volume:118 Page:223-228
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Conway P. P.¹,Kalantary M. R.¹,Williams D. J.¹

Affiliation:

1. Department of Manufacturing Engineering, Loughborough University of Technology, Loughborough, Leicestershire, United Kingdom LE11 3TU

Abstract

As part of a major project to develop a computer-based model to support the product and process design activity for reflow soldered assemblies, it has been found necessary to carry out fundamental investigations of the processes occurring as solder pastes approach and pass the reflow temperature. This paper presents the results and our interpretation of the observed physical phenomena arising from recent high-speed video microscopy studies of the reflow of bulk deposits of solder paste and also of the formation of solder joints during infrared reflow soldering. These studies have provided insights into the physical phenomenology of reflowing solder paste, the interpretation of wetting curves and the mechanisms behind the formation of manufacturing driven defects.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/118/4/223/5881999/223_1.pdf

Reference19 articles.

1. Agyayo, K., November 1991, “Increasing Soldering Yields Through the Use of a Nitrogen Atmosphere,” Journal of Surface Mount Technology, pp. 3–9.

2. Boettinger, W. J., Handwerker, C. A., and Kattner, U. R., 1993, “Reactive Wetting and Intermetallic Formation,” The Mechanics of Solder Alloy Wetting and Spreading, F. G. Yost, F. M. Hosking, and D. R. Frear, eds., Van Nostrand Reinhold, N.Y., pp. 103–140.

3. Brakke K. , 1992, “The Surface Evolver,” Experimental Mathematics, Vol. 1, No. 2, pp. 141–165.

4. Conway, P. P., Williams, D. J., and Whalley, D. C., 1991a, “Joint-Level Thermal Modeling of Infrared Reflow for Different Termination Geometries,” Proc. 1st Int. Conf. Factory Automation and Information Management, Limerick, Ireland, pp. 219–228.

5. Conway P. P. , WilliamsD. J., and WhalleyD. C., 1991b, “Experiments to Allow the Interpretation of a Computer Based Model of the Solder Paste Reflow Process,” Journal of Processing of Advanced Materials, Vol. 1, No. 3/4, pp. 175–180.

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1. Simulative Analysis on Factors Influencing Solder Joint Bridging of Fine Pitch Devices;Journal of Electronic Packaging;2004-03-01

2. A study on the solderability of QFP outer lead using Nd:YAG laser;Metals and Materials;1999-05