Affiliation:
1. AT&T Bell Laboratories, Murray Hill, New Jersey 07974
Abstract
We discuss the role of theoretical and, in particular, analytical modeling in mechanical problems for electronic packaging, including requirements for a feasible theoretical model, how such a model is developed, the role of mathematics, what can be gained by using theoretical modeling, as well as the interaction of analytical, numerical (computer-aided) and experimental models. Peculiarities of theoretical modeling in Structural Analysis are also briefly discussed.
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Cited by
24 articles.
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