Design for Reliability of Electronic Materials and Systems
Author:
Publisher
Springer Berlin Heidelberg
Link
http://link.springer.com/content/pdf/10.1007/978-3-662-55771-6_372
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5. Suhir E (1989) Analytical modeling in structural analysis for electronic packaging: its merits, shortcomings and interaction with experimental and numerical techniques. ASME J Electr Pack 111(2):157–161
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