Affiliation:
1. Department of Mechanical Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong
Abstract
Wire sweep has been recognized as a critical process defect which can result in device failure. The phenomenon is very complicated as it is sensitive to a large number of parameters. In this experimental work, the influence of some of the more important factors is investigated. These parameters include fluid-flow speed, wire-bond density, mold cavity height, and mold vent size. A 160L QFP package bonded with gold wires in a transparent mold is used as the test vehicle.
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Reference9 articles.
1. Chen, X. H., Yuen, M. M. F., and Tong, P., 1996, “Flow Modeling of Wire Sweep in Transfer Molding,” Proceedings, ASME Winter Annual Meeting, EEP-Vol. 17, p. 55.
2. Han
S.
, and WangK. K., 1995, “A Study on Wire Sweep in Encapsulation of Semiconductor Chips Using Simulated Experiments,” ASME JOURNAL OF ELECTRONIC PACKAGING, Vol. 117, p. 178178.
3. Hunter
W. L.
, 1987, “Association of Bonding-Wire Displacement With Gas Bubbles in Plastic-Encapsulated Integrated Circuits,” IEEE Trans. Comp., Hybrids, Manuf. Tech., CHMT-10, p. 327327.
4. Manzione, L. T., 1983, “Packaging of Microelectronic Devices,” SPE 41st AN-TEC, p. 77.
5. Nguyen
L. T.
, 1988, “Wire Bond Behavior During Molding Operations of Electronic Packages,” Polym. Eng. Sci., Vol. 28, p. 926926.
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