Transfer Molding Wire Sweep Improvement in QFP Packages by Mold Plunger Tips Design
Author:
Affiliation:
1. STMicroelectronics Sdn. Bhd,QFP Department,Muar,MALAYSIA
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9969384/9969385/09969489.pdf?arnumber=9969489
Reference6 articles.
1. Wire sweep during molding of integrated circuits
2. Top Gate Molding and Wire Sweep Improvement in Full Plastic QFP Packages
3. Wire sweep characterization of multi-tier palladium-copper (Pd-Cu) wire bonding on LQFP package using low alpha green mold compound
4. Wire bond loop profile development for fine pitch-long wire assembly
5. Wire Sweep Due to Transfer Molding in a 160L QFP Package Under Steady-State Conditions
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1. Wire loop characterization for wire sweep reduction;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05
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