Wire sweep during molding of integrated circuits
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx5/157/3478/00122278.pdf?arnumber=122278
Cited by 12 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Transfer Molding Wire Sweep Improvement in QFP Packages by Mold Plunger Tips Design;2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT);2022-10-19
2. Effects of Stacked Layers and Stacked Configurations on Wire Sweep and Wire Sag of Advanced Overhang/Pyramid Stacked Packages;Journal of Electronic Packaging;2017-07-27
3. Improving the deflection of wire bonds in stacked chip scale package (CSP);Microelectronics Reliability;2003-12
4. Effects of molding compound on wire sweep in plastic encapsulated IC packages;Electronics and Communications in Japan (Part II: Electronics);1999-11
5. Factors governing wire sweep in plastic IC encapsulation;Electronics and Communications in Japan (Part II: Electronics);1999-07
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