A Study on Wire Sweep in Encapsulation of Semiconductor Chips Using Simulated Experiments-Reference-Cited by-同舟云学术

A Study on Wire Sweep in Encapsulation of Semiconductor Chips Using Simulated Experiments

Published:1995-09-01 Issue:3 Volume:117 Page:178-184
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Han Sejin¹,Wang K. K.¹

Affiliation:

1. Cornell Injection Molding Program, Sibley School of Mechanical and Aerospace Engineering, Cornell University, Ithaca, NY 14853

Abstract

An effort has been made in this study to develop a model which can predict wire sweep during semiconductor chip encapsulation with transfer molding. The calculation of wire sweep during encapsulation depends on many factors. In this study, a step-by-step approach has been used considering one factor at a time. As the first step, the wire deformation has been measured and calculated under a known dead-weight loading. The next step has been to measure and calculate the deformation of a single straight wire attached to the mid-plane of a rectangular cavity due to the flow of a clear and homogeneous fluid. Finally, the wire deformation due to the flow has been measured and calculated when a wire of general shape is attached to a leadframe. The effect of bubble on the wire-sweep has been analyzed qualitatively. Through this series of experiments, a first step in the development of model for the prediction of wire sweep during chip encapsulation has been made.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/117/3/178/5613034/178_1.pdf

Reference18 articles.

1. ASTM, 1984, “Standard Methods of Testing: Fine Round and Flat Wire for Electron Devices and Lamps,” Designation: F, pp. 219–79.

2. Berker, R., 1963, Handbuch der Physik, VIII, part 2, Springer-Verlag.

3. Bird, R. B., Armstrong, R. C., and Hassager, O., 1987, Dynamics of Polymeric Liquids, Vol. 1, Wiley-Interscience, New York.

4. Hieber, C. A., 1987, Chapter 1 of Injection and Compression Molding Fundamentals, A. I. Isayev, ed., Marcel Dekker, New York.

5. Huebner, K. H., and Thornton, E. A., 1982, The Finite Element Method for Engineers, Wiley, New York.

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