The wire sag problem in wire bonding technology for semiconductor packaging-Reference-Cited by-同舟云学术

The wire sag problem in wire bonding technology for semiconductor packaging

Published:2013-02 Issue:2 Volume:53 Page:288-296
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Kung Huang-Kuang,Chen Hung-Shyong,Lu Ming-Cheng

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference31 articles.

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5. Bond Wire Modeling Standard. EIA/JESD59, EIA/JEDEC STANDARD; 1997.

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