IMC Growth of Solid State Reaction between Ni UBM and Sn–3Ag–0.5Cu and Sn–3.5Ag Solder Bump Using Ball Place Bumping Method during Aging
Author:
Affiliation:
1. Advanced Technology Research Laboratories, Nippon Steel Corp.
2. New Materials Division Nippon Steel Corp.
Publisher
Japan Institute of Metals
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
https://www.jstage.jst.go.jp/article/matertrans/46/11/46_11_2351/_pdf
Reference17 articles.
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4. 4) A. Sharif, M. N. Islam and Y. C. Chan: Mater. Sci. Eng. B 113 (2004) 184–189.
5. 5) J. W. Yoon, S. W. Kim and S. B. Jung: J. Alloys Compd. 391 (2005) 82–89.
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