Electrodeposition Complexity and the Root Cause of Interfacial Voiding in Solder Joints with Plated Nickel-Reference-Cited by-同舟云学术

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Electrodeposition Complexity and the Root Cause of Interfacial Voiding in Solder Joints with Plated Nickel

Published:2024-01-05 Issue:1 Volume:6 Page:457-464
ISSN:2637-6113
Container-title:ACS Applied Electronic Materials
language:en
Short-container-title:ACS Appl. Electron. Mater.

Author:

Lei Zhen¹,Borgesen Peter²,Dimitrov Nikolay¹^ORCID

Affiliation:

1. Department of Chemistry, State University of New York (SUNY) at Binghamton, P.O. Box 6000, Binghamton, New York 13902, United States

2. Department of System Science and Industrial Engineering, SUNY at Binghamton, P.O. Box 6000, Binghamton, New York 13902, United States

Funder

Integrated Electronics Engineering Center, Binghamton University

Publisher

American Chemical Society (ACS)

Link

https://pubs.acs.org/doi/pdf/10.1021/acsaelm.3c01455

Reference37 articles.

1. Understanding and preventing Cu–Sn micro joint defects through design and process control

2. Enhanced voiding in Cu-Sn micro joints

3. Effect of Intermetallic Morphology Evolution on Void Formation in Ni/Sn/Ni Micro Joints

4. Toward a Better Understanding of the Effect of Cu Electroplating Process Parameters on Cu3Sn Voiding

5. Failure mechanism of brittle solder joint fracture in the presence of electroless nickel immersion gold (ENIG) interface

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Hydrogen evolution and thermal treatments for removal of plating induced impurities from Ni to extend life of solder joints;Colloids and Surfaces A: Physicochemical and Engineering Aspects;2024-07

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