Hydrogen evolution and thermal treatments for removal of plating induced impurities from Ni to extend life of solder joints
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Published:2024-07
Issue:
Volume:692
Page:133995
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ISSN:0927-7757
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Container-title:Colloids and Surfaces A: Physicochemical and Engineering Aspects
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language:en
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Short-container-title:Colloids and Surfaces A: Physicochemical and Engineering Aspects
Author:
Lei Zhen,
Borgesen PeterORCID,
Dimitrov NikolayORCID
Funder
Binghamton University
IEEC