Effect of Intermetallic Morphology Evolution on Void Formation in Ni/Sn/Ni Micro Joints-Reference-Cited by-同舟云学术

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Effect of Intermetallic Morphology Evolution on Void Formation in Ni/Sn/Ni Micro Joints

Published:2020-06 Issue: Volume: Page:
ISSN:
Container-title:2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
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Author:

Thekkut S.,Das R.,Njuki M.,Li J.,Sivasubramony R. S.,Alshatnawi F. W.,Moise M.,Greene C. M.,Dimitrov N. G.,Borgesen P.,Shahane N.,Thompson P.,Mirpuri K.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9151098/9159179/09159360.pdf?arnumber=9159360

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Electrodeposition Complexity and the Root Cause of Interfacial Voiding in Solder Joints with Plated Nickel;ACS Applied Electronic Materials;2024-01-05

2. Preventing Void Growth Between Ni3Sn4 and Solder;Journal of Electronic Materials;2022-08-17

3. Enhanced voiding in Cu-Sn micro joints;Materials Research Bulletin;2022-06

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