Direct Bonding to Aluminum with Silver-Oxide Microparticles
Author:
Affiliation:
1. Materials Research Laboratory, Hitachi Ltd.
2. Division of Materials and Manufacturing Science, Osaka University
Publisher
Japan Institute of Metals
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
https://www.jstage.jst.go.jp/article/matertrans/50/1/50_MRP2008277/_pdf
Reference7 articles.
1. 1) T. Morita, Y. Yasuda, E. Ide, Y. Akada and A. Hirose: Mater. Trans. 49 (2008) 2875–2880.
2. 2) A. Hirose, E. Ide and K. F. Kobayashi: Jpn. Inst. Electron. Packag. 7 (2004) 511–515.
3. 3) E. Ide, S. Angata, A. Hirose and K. F. Kobayashi: Acta Mater. 53 (2005) 2385–2393.
4. 4) E. Ide, A. Hirose and K. F. Kobayashi: Mater. Trans. 47 (2006) 211–217.
5. 5) T. Morita, E. Ide, Y. Yasuda, A. Hirose and K. Kobayashi: Jpn. J. Appl. Phys. 47 (2008) 6615–6622.
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