Technology for Improving Heat Resistance Reliability of Power Modules
Author:
Affiliation:
1. Power Circuit Integration Team, Advanced Power Electronics Research Center, National Institute of Advanced Industrial Science and Technology
Publisher
Sumart Processing Society for Minerals, Environment and Energy
Link
https://www.jstage.jst.go.jp/article/jspmee/9/6/9_264/_pdf
Reference20 articles.
1. T. Morita, Y. Yasuda, E. Ide, Y. Akada and A. Hirose: “Bonding Technique Using Micro-Scaled Silver-Oxide Particles for In-Situ Formation of Silver Nanoparticles”, Materials Transactions, 49-12 （2008）, 2875-2880.
2. T. Morita, Y. Yasuda, E. Ide and A. Hirose: “Direct Bonding to Aluminum with Silver-oxide Microparticles”, Materials Transactions, 50-1（2009）, 226-228.
3. Y. Yasuda, E. Ide, and T. Morita: “Low-Temperature Bonding Using Silver Nanoparticles Stabilized by Short-Chain Alkylamines”, Japanese Journal of Applied Physics, 48（2009）, 125004.
4. A. Hirose, H. Tatsumi, N. Takeda, Y. Akada, Tomo Ogura, E. Ide and T. Morita: “A novel metal-to-metal bonding process through in-situ formation of Ag nanoparticles using Ag2O microparticles” Journal of Physics: Conference Series 165（2009）, 012074.
5. Y. Yasuda, N. Tokoo, T. Morita and K. Suzuki: “Reliability of sintered silver layer obtained using silver-oxide paste in power cycling test”, Japanese Journal of Applied Physics, 54（2015）, 010302.
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