Bonding Technique Using Micro-Scaled Silver-Oxide Particles for <I>In-Situ</I> Formation of Silver Nanoparticles-Reference-Cited by-同舟云学术

Bonding Technique Using Micro-Scaled Silver-Oxide Particles for In-Situ Formation of Silver Nanoparticles

Published:2008 Issue:12 Volume:49 Page:2875-2880
ISSN:1345-9678
Container-title:MATERIALS TRANSACTIONS
language:en
Short-container-title:Mater. Trans.

Author:

Morita Toshiaki¹,Yasuda Yusuke¹,Ide Eiichi¹,Akada Yusuke²,Hirose Akio²

Affiliation:

1. Materials Research Laboratory, Hitachi Ltd.

2. Division of Materials and Manufacturing Science, Osaka University

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.jstage.jst.go.jp/article/matertrans/49/12/49_MRA2008269/_pdf

Reference11 articles.

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3. 3) M. Takagi: J. Phys. Soc. Jpn. 9 (1954) 359–363.

4. 4) J. R. Groza and R. J. Dowding: Nanostruct. Mater. 7 (1996) 749–768.

5. 5) G. L. Allen, R. A. Bayles, W. W. Gile and W. A. Jesser: Thin Solid Films 144 (1986) 297–308.

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