Effect of Ni or Co Addition to Sn-Ag Solder on Microstructure and Joint Strength at Interface
Author:
Affiliation:
1. Joining and Welding Research Institute, Osaka University
2. Graduate school of Engineering, Osaka University
Publisher
Japan Institute of Metals
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
https://www.jstage.jst.go.jp/article/matertrans/49/7/49_MF200851/_pdf
Reference24 articles.
1. 1) Official Journal of the European Union, February 13, (2003), L37/19-L37/23 L37/24-L37/38.
2. 2) T. Takemoto: Materia Japan 35 (1996) 320–325.
3. 3) T. Takemoto: J. Japan Weld Soc. 69 (2000) 100–107.
4. 4) T. Takemoto and M. Miyazaki: Mater. Trans. 42 (2001) 745–750.
5. 5) S. H. Huh, K. S. Kim and K. Suganuma: Mater. Trans. 42 (2001) 739–744.
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