Characteristics of Isotropically Conductive Adhesive (ICA) Filled with Carbon Nanotubes (CNTs) and Low-Melting-Point Alloy Fillers

Author:

Yim Byung-Seung1,Kim Jong-Min1

Affiliation:

1. School of Mechanical Engineering, Chung-Ang University

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Cited by 22 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

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5. Effect of curing agent and curing substrate on low temperature curable silver conductive adhesive;Journal of Materials Science: Materials in Electronics;2019-01-02

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