Effect of Zn Addition on Interfacial Reactions Between Sn-Bi Solder and Cu Substrate
Author:
Affiliation:
1. Joining and Welding Research Institute, Osaka University
2. Department of Electronic Engineering, City University of Hong Kong
Publisher
Japan Institute of Metals
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
https://www.jstage.jst.go.jp/article/matertrans/57/8/57_MD201515/_pdf
Reference20 articles.
1. 1) H.R. Kotadia, P.D. Howes and S.H. Mannan: Microelectron. Reliab. 54 (2014) 1253–1273. 10.1016/j.microrel.2014.02.025
2. 2) C.H. Raeder, L.E. Felton, V.A. Tanzi and D.B. Knorr: J. Electron. Mater. 23 (1994) 611–617. 10.1007/BF02653346
3. 3) C.H. Raeder, R.W. Messler and L.F. Coffin: J. Electron. Mater. 28 (1999) 1045–1054. 10.1007/s11664-999-0182-z
4. 4) H. Okamoto: J. Phase Equilibria Diffus. 31 (2010) 205–205. 10.1007/s11669-010-9659-y
5. 5) W. Dong, Y. Shi, Z. Xia, Y. Lei and F. Guo: J. Electron. Mater. 37 (2008) 982–991. 10.1007/s11664-008-0458-8
Cited by 16 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Effects of Different Zinc Content on Solidification, Microstructure, and Mechanical Properties in Tin–Bismuth Alloy;Advanced Engineering Materials;2024-07-30
2. A Thermodynamic Modeling Approach for the Design and Development of Low-Temperature Solder Alloys;2024 International Conference on Electronics Packaging (ICEP);2024-04-17
3. Coupled effect of Ag and In addition on the microstructure and mechanical properties of Sn–Bi lead-free solder alloy;Journal of Materials Research and Technology;2023-09
4. Effect of the Solder Powder Size of Sn-Bi-Ag-In Lead-Free Solder on the Wettability and Microstructure of Cu Substrate;Materials Performance and Characterization;2023-06-16
5. A Review of Low-Temperature Solders in Microelectronics Packaging;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-04
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3