Ultrasonic-Assisted Soldering of Low-Ag SAC Lead-Free Solder Paste at Low-Temperature-Reference-Cited by-同舟云学术

Ultrasonic-Assisted Soldering of Low-Ag SAC Lead-Free Solder Paste at Low-Temperature

Published:2018 Issue:3 Volume:59 Page:359-366
ISSN:1345-9678
Container-title:MATERIALS TRANSACTIONS
language:en
Short-container-title:Mater. Trans.

Author:

Gan Gui-Sheng¹²,Gan Lin-Qiao³,Guo Ji-Zhao²,Xia Da-Quan²,Zhang Chunhong²,Yang Donghua²,Wu Yiping¹,Liu Cong²

Affiliation:

1. College of Materials Science and Engineering, Huazhong University of Science and Technology

2. Chongqing Municipal Engineering Research Center of Institutions of Higher Education for Special Welding Materials and Technology (Chongqing University of technology)

3. School of Mechanical Electronic & Information Engineering, China University of Mining & Technology

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.jstage.jst.go.jp/article/matertrans/59/3/59_M2017255/_pdf

Reference17 articles.

1. 1) N. Mookam and K. Kanlayasiri: J. Alloy. Compd. 509 (2011) 6276–6279. 10.1016/j.jallcom.2011.03.049

2. 2) D.A. Shnawah, S.B.M. Said, M.F.M. Sabri, I.A. Badruddin and F.X. Chen: J. Electron. Mater. 41 (2012) 2631–2658. 10.1007/s11664-012-2145-z

3. 3) D.A. Shnawah, M.F.M. Sabri and I.A. Badruddin: Microelectron. Reliab. 52 (2012) 90–99. 10.1016/j.microrel.2011.07.093

4. 4) K. Kanlayasiri, M. Mongkolwongrojn and T. Ariga: J. Alloy. Compd. 485 (2009) 225–230. 10.1016/j.jallcom.2009.06.020

5. 5) M. Sona and K.N. Prabhu: Trans. Indian Inst. Met. 68 (2015) 1027–1031. 10.1007/s12666-015-0640-7

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of Nanosized Ni Reinforcements on the Structure of the Sn-3.0Ag-0.5Cu Alloy in Liquid and After-Reflow Solid States;Metals;2023-06-09

2. Properties of Cu/Zn+15%SAC0307+15%Cu/Al joints by different ultrasonic-assisted degrees;Microelectronics International;2023-03-07

3. Influence of bonding temperature on the properties of Cu/(SAC mixed powder)/Al joints under ultrasonic-assisted;Soldering & Surface Mount Technology;2023-01-24

4. Influence of aging temperature on the properties of Cu/(SAC0307 powder +Zn-particles)/Al joints ultrasonic-assisted soldered at low temperature;Soldering & Surface Mount Technology;2022-10-25

5. Properties of Cu/SAC0307 mixed solder balls/Cu joints with different Zn-particles content at low-temperature under ultrasonic assisted;Soldering & Surface Mount Technology;2022-09-30