Electrolytic Copper Deposition from Ammoniacal Alkaline Solution Containing Cu(I)-Reference-Cited by-同舟云学术

Electrolytic Copper Deposition from Ammoniacal Alkaline Solution Containing Cu(I)

Published:2006 Issue:8 Volume:47 Page:2076-2080
ISSN:1345-9678
Container-title:MATERIALS TRANSACTIONS
language:en
Short-container-title:Mater. Trans.

Author:

Koyama Kazuya¹,Tanaka Mikiya¹,Miyasaka Yukio²,Lee Jae-chun³

Affiliation:

1. Metals Recycling Group, Research Institute for Environmental Management Technology, National Institute of Advanced Industrial Science and Technology (AIST)

2. Department of Metallurgical Engineering, Chiba Institute of Technology

3. Minerals and Materials Processing Division, Korea Institute of Geoscience & Mineral Resources (KIGAM)

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.jstage.jst.go.jp/article/matertrans/47/8/47_8_2076/_pdf

Reference12 articles.

1. 1) K. Koyama, M. Tanaka and J.-C. Lee: Maters. Trans. 47 (2006) 1788–1792.

2. 2) A. Schimmel: Ind. Eng. Chem. 43 (1951) 2943–2948.

3. 3) J. Sedzimir and B. Kustowska: Hydrometallurgy 8 (1982) 355–364.

4. 4) D. M. Muir, A. J. Parker, J. H. Sharp and W. E. Waghorne: Hydrometallurgy 1 (1975) 61–77.

5. 5) D. M. Muir, A. J. Parker, J. H. Sharp and W. E. Waghorne: Hydrometallurgy 1 (1975) 155–168.

Cited by 22 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Kinetics and Modeling of Counter-Current Leaching of Waste Random-Access Memory Chips in a Cu-NH3-SO4 System Utilizing Cu(II) as an Oxidizer;Materials;2023-09-19

2. Kinetic Study of Cu Leaching Mechanism from Waste RAM Chips Using Cu(II)-NH3-SO4 Solution;SSRN Electronic Journal;2022

3. Hydrometallurgical recovery of high-purity copper cathode from highly impure crude copper;Resources, Conservation and Recycling;2021-04

4. Selective leaching of copper from waste printed circuit boards (PCBs) using glycine as a complexing agent;Global NEST: the international Journal;2021-02-22

5. The behavior of cuprous species at electrodes polarized in hydrochloric acid solutions;Journal of Applied Electrochemistry;2020-03-31