Copper Leaching Behavior from Waste Printed Circuit Board in Ammoniacal Alkaline Solution-Reference-Cited by-同舟云学术

Copper Leaching Behavior from Waste Printed Circuit Board in Ammoniacal Alkaline Solution

Published:2006 Issue:7 Volume:47 Page:1788-1792
ISSN:1345-9678
Container-title:MATERIALS TRANSACTIONS
language:en
Short-container-title:Mater. Trans.

Author:

Koyama Kazuya¹,Tanaka Mikiya¹,Lee Jae-chun²

Affiliation:

1. Metals Recycling Group, Research Institute for Environmental Management Technology, National Institute of Advanced Industrial Science and Technology (AIST)

2. Minerals and Materials Processing Division, Korea Institute of Geoscience & Mineral Resources(KIGAM)

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.jstage.jst.go.jp/article/matertrans/47/7/47_7_1788/_pdf

Reference9 articles.

1. 1) H. Majima, S. Nigo, T. Hirato, Y. Awakura and M. Iwai: J. Min. Mater. Proc. Inst. Japan (Shigen-to-Sozai) 109 (1993) 191–194.

2. 2) S. Nigo, H. Majima, T. Hirato, Y. Awakura and M. Iwai: J. Min. Mater. Proc. Inst. Japan (Shigen-to-Sozai) 109 (1993) 337–340.

3. 3) K. Zhou, K. Shinme and S. Anezaki: J. Min. Mater. Proc. Inst. Japan (Shigen-to-Sozai) 111 (1995) 49–53.

4. 4) K. Zhou, K. Shinme and S. Anezaki: J. Min. Mater. Proc. Inst. Japan (Shigen-to-Sozai) 111 (1995) 55–58.

5. 5) J. Sedzimir and M. Bujanska: Hydrometallurgy 3 (1978) 233–248.

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