Cuprous hydrometallurgy
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Industrial and Manufacturing Engineering
Reference15 articles.
1. Copper, the metal, its alloy and compounds;Butts,1954
2. Solvation of ions: Some applications. Part I. Electrorefining of silver via silver sulphate solution in mixtures of water with 2-hydroxycyanoethane;Diggle;Aust. J. Chem.,1974
3. Electrochemical behaviour of copper ions and silver ion in hydracrylonitrile and some related nitriles;Farha;J. Electroanal. Chem.,1964
4. Mechanism of the reaction at a Cu/Cu2+ electrode;Hillson;Trans. Faraday Soc.,1954
5. Diffusion layer interpretation of the interaction of electrorefining addition agents;Jennings;Metall. Trans.,1973
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1. Electrodeposition from Cationic Cuprous Organic Complexes: Ionic Liquids for High Current Density Electroplating;Journal of The Electrochemical Society;2011
2. Role of Acetonitrile in Via-Filling by Copper Electrodeposition;Journal of The Surface Finishing Society of Japan;2007
3. Effect of Acetonitrile on Crystal Orientation of Copper Film Electrodeposited from Acid Cupric Sulfate Electrolyte;Journal of The Surface Finishing Society of Japan;2007
4. Electrolytic Copper Deposition from Ammoniacal Alkaline Solution Containing Cu(I);MATERIALS TRANSACTIONS;2006
5. New solvent systems for the recycling of metals;Conservation & Recycling;1986-01
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