Microstructural Evolution of Nanoindented Ag/Si Thin-Film under Different Annealing Temperatures-Reference-Cited by-同舟云学术

Microstructural Evolution of Nanoindented Ag/Si Thin-Film under Different Annealing Temperatures

Published:2011 Issue:10 Volume:52 Page:1868-1875
ISSN:1345-9678
Container-title:MATERIALS TRANSACTIONS
language:en
Short-container-title:Mater. Trans.

Author:

Lee Woei-Shyan¹,Chen Tao-Hsing²,Lin Chi-Feng³,Wu Cheng-Lun¹

Affiliation:

1. Department of Mechanical Engineering, National Cheng Kung University

2. Department of Mechanical Engineering, National Kaohsiung University of Applied Sciences

3. National Center for High-Performance Computing

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.jstage.jst.go.jp/article/matertrans/52/10/52_M2011160/_pdf

Reference36 articles.

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4. 4) R. Saha and W. D. Nix: Acta Mater. 50 (2002) 23–28.

5. 5) J. Lou, P. Shrotriya, T. Buchheit, D. Yang and W. O. Soboyejo: J. Mater. Res. 18 (2003) 719–728.

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