A Reliability Study of Nanoparticles Reinforced Composite Lead-Free Solder-Reference-Cited by-同舟云学术

A Reliability Study of Nanoparticles Reinforced Composite Lead-Free Solder

Published:2010 Issue:10 Volume:51 Page:1720-1726
ISSN:1345-9678
Container-title:MATERIALS TRANSACTIONS
language:en
Short-container-title:Mater. Trans.

Author:

Chen Si¹,Zhang Lili¹,Liu Johan¹²,Gao Yulai³,Zhai Qijie³

Affiliation:

1. Key Laboratory of Advanced Display and System Applications & SMIT Center, School of Automation and Mechanical Engineering, Shanghai University

2. SMIT Center & Bionano Systems Laboratory, Department of Microtechnology and Nanoscience, Chalmers University of Technology

3. School of Materials Science and Engineering, Shanghai University

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.jstage.jst.go.jp/article/matertrans/51/10/51_MJ201002/_pdf

Reference17 articles.

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2. 2) L. Y. Hsiao, G. J. Chiou, J. G. Duh and S. Y. Tsai: Proc. 7th IEEE CPMT Int. Conf. on Electronics Packaging Technology, (2006) pp. 358–363.

3. 3) Y. W. Shi, J. P. Liu, Z. D. Xia, Y. P. Lei, F. Guo and X. Y. Li: J. Mater. Sci. Mater. Electron. 19 (2008) 349–356.

4. 4) A. K. Gain, Y. C. Chan, K. C. Yung, A. Sharif and L. Ali: Proc. 2nd IEEE CPMT Conf. on Electronics System Integration Technology, (2008) pp. 1291–1294.

5. 5) A. Lee and K. N. Subramanian: Electron. Mater. 34 (2005) 1399–1407.

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