Reducing Cracking in Solder Joint Interfacial Cu<sub>6</sub>Sn<sub>5</sub> with Modified Reflow Profile-Reference-Cited by-同舟云学术

Reducing Cracking in Solder Joint Interfacial Cu₆Sn₅ with Modified Reflow Profile

Published:2020 Issue:0 Volume:13 Page:E19-004-1-E19-004-11
ISSN:1883-3365
Container-title:Transactions of The Japan Institute of Electronics Packaging
language:en
Short-container-title:Transactions of The Japan Institute of Electronics Packaging

Author:

Somidin Flora¹²,McDonald Stuart David¹,Ye Xiaozhou¹,Qu Dongdong¹,Sweatman Keith¹³,Akaiwa Tetsuya³,Nishimura Tetsuro³,Nogita Kazuhiro¹

Affiliation:

1. Nihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM), School of Mechanical and Mining Engineering, The University of Queensland

2. Centre of Excellence Geopolymer and Green Technology, School of Materials Engineering, Universiti Malaysia Perlis (UniMAP)

3. Nihon Superior Co. Ltd.

Publisher

Japan Institute of Electronics Packaging

Link

https://www.jstage.jst.go.jp/article/jiepeng/13/0/13_E19-004-1/_pdf

Reference29 articles.

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3. [3] J. B. Libot, J. Alexis, O. Dalverny, L. Arnaud, P. Milesi, and F. Dulondel, "Microstructural evolutions of Sn-3.0Ag-0.5Cu solder joints during thermal cycling," Microelectronics Reliability, Vol. 83, pp. 64–76, 2018.

4. [4] T. Gu, C. M. Gourlay, and T. B. Britton, "Evaluating Creep Deformation in Controlled Microstructures of Sn-3Ag-0.5Cu Solder," Journal of Electronic Materials, Vol. 48, No. 1, pp. 107–121, 2019.

5. [5] K. N. Reeve, J. R. Holaday, S. M. Choquette, I. E. Anderson, and C. A. Handwerker, "Advances in Pb-free Solder Microstructure Control and Interconnect Design," Journal of Phase Equilibria and Diffusion, Vol. 37, No. 4, pp. 369–386, 2016.

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