Fine Trace Substrate with 2 μm Fine Line for Advanced Package
Author:
Affiliation:
1. NBD, Unimicron Technology Corp
Publisher
Japan Institute of Electronics Packaging
Link
https://www.jstage.jst.go.jp/article/jiepeng/8/1/8_18/_pdf
Reference5 articles.
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2. [2] W. Flack, R. Hsieh, G. Kenyon, and M. Ranjan, "Large area interposer lithography," Proc. IEEE Electronic Components and Technolo. Conf. (ECTC), Orlando, FL, USA, 2014, pp. 26-32.
3. [3] A. Shorey, P. Cochet, A. Huffman, J. Keech, M. Lueck, S. Pollard, and K. Ruhmer, "Advancements in Fabrication of glass interposer," Proc. IEEE Electronic Components and Technolo. Conf. (ECTC), Orlando, FL, USA, 2014, pp. 20-25.
4. [4] Y. Suzuki, Y. Takagi, V. Sundaram, and R. Tummala, "Thin polymer dry-film dielectric material and a process for 10 μm interlayer vias in high density organic and glass interposers," Proc. IEEE Electronic Components and Technolo. Conf. (ECTC), Orlando, FL, USA, 2014, pp. 1427-1432.
5. [5] H. Narahasi, S. Nakamura, and T. Yokota, "Novel thin copper transfer films for fine line formation on pcb substrates," Transactions of The Japan Institute of Electronics Packaging, Vol. 3, No. 1, pp. 86-90, 2010.
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