Trench Wiring Process Applying Electroless Nickel Plating for Fine and High-Aspect-Ratio Pattern-Reference-Cited by-同舟云学术

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Trench Wiring Process Applying Electroless Nickel Plating for Fine and High-Aspect-Ratio Pattern

Published:2019-06-24 Issue:3 Volume:32 Page:475-479
ISSN:0914-9244
Container-title:Journal of Photopolymer Science and Technology
language:en
Short-container-title:J. Photopol. Sci. Technol.

Author:

Yokochi Seigo¹,Yoshida Tetuya¹,Iwashita Kenichi¹,Tsukahara Yoshito²,Komatsu Masashi²

Affiliation:

1. Hitachi Chemical Co. Ltd.

2. Meltex Inc.

Publisher

Technical Association of Photopolymers, Japan

Subject

Materials Chemistry,Organic Chemistry,Polymers and Plastics

Link

https://www.jstage.jst.go.jp/article/photopolymer/32/3/32_475/_pdf

Reference21 articles.

1. 1. T. Kanki, J. Ikeda, Y. Kobayashi, S.Suda, Y. Nakata, and T. Nakamura, Proc. IEEE IITC, (2012) 92.

2. 2. D.-C. Hu, P. Lin, and Y. H. Chen, Trans. Jpn. Inst. Electron. Packaging, 8 (2015) 18.

3. 3. F. Liu, A. Kubo, C. Nair, T. Ando, R. Furuya, S. Dwarakanth, V. Sundaram, and Rao R. Tummala, IEEE ECTC, (2016) 1515.

4. 4. C. H. Yu, L. J. Hesieh, J. S. Hesieh, Victor C. Y. Chang, C. H. Hesieh, C. S. Liu, C. T. Wang, K. C. Yee, and D. C. H. Yu, IEEE ECTC, (2018) 587.

5. 5. D. C. Hu, W. L. Yeh, Y. H. Chen, and R. Tain, IEEE ECTC, (2016) 147.

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