Novel Trench Wiring Formation Process using Photosensitive Insulation Film for Next Generation Packaging-Reference-Cited by-同舟云学术

Novel Trench Wiring Formation Process using Photosensitive Insulation Film for Next Generation Packaging

Published:2016 Issue:3 Volume:29 Page:391-394
ISSN:0914-9244
Container-title:Journal of Photopolymer Science and Technology
language:en
Short-container-title:J. Photopol. Sci. Technol.

Author:

Iwashita Kenichi¹,Katoh Tetsuya¹,Nakamura Akihiro¹,Murakami Yasuharu¹,Iwasaki Tomio²

Affiliation:

1. Hitachi Chemical Co. Ltd.

2. Hitachi, Ltd.

Publisher

Technical Association of Photopolymers, Japan

Subject

Materials Chemistry,Organic Chemistry,Polymers and Plastics

Link

https://www.jstage.jst.go.jp/article/photopolymer/29/3/29_391/_pdf

Reference6 articles.

1. 1. T. Kanki, J. Ikeda, Y. Kobayashi, S. Suda, Y. Nakata and T. Nakamura, IEEE IITC2012, 978-1-4673-1138-0.

2. 2. D-C Hu, P. Lin and Y. H. Chen, Transactions of The Japan Institute of Electronics Packaging, 8 (2015) 18.

3. 3. N. Shimizu, W. Kaneda, H. Arisaka, N. Koizumi S. Sunohara, A. Rokugawa and T. Koyama, IMPAS 2013, Oct.3, TP65, p414.

4. 4. R. Huemoeller, S. Rusli, A. Chiang, Y. Chen, D. Baron, L. Brandt and B. Roelfts. "UNVEILING THE NEXT GENERATION IN SUBSTRATE TECHNOLOGY", Amkor Technology, Packaging white paper, 2007, 20(1), http://www.amkor.com/go/packaging/substrate-technology

5. 5. R. Rubner, Adv Mater., 2 (1990) 452.

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