Evaluation of Residual Stress on Chip Using Capillary Underfill and Non-Conductive Film Caused by Flip-Chip Bonding Process Using Test Element Group Chips with Piezoresistive Sensors-Reference-Cited by-同舟云学术

Evaluation of Residual Stress on Chip Using Capillary Underfill and Non-Conductive Film Caused by Flip-Chip Bonding Process Using Test Element Group Chips with Piezoresistive Sensors

Published:2015 Issue:1 Volume:8 Page:127-137
ISSN:1883-3365
Container-title:Transactions of The Japan Institute of Electronics Packaging
language:en
Short-container-title:Transactions of The Japan Institute of Electronics Packaging

Author:

Enami Toshio¹²,Nanami Kyosuke²,Horiuchi Osamu³,Han Young-Gun³,Tomokage Hajime²³

Affiliation:

1. R&D Institute High Performance Plastics Company, Sekisui Chemical Co., Ltd.

2. Department of Electronic Engineering and Computer Science, Fukuoka University

3. Center of System Integration Platform Organization Standards (CSIPOS), Fukuoka University

Publisher

Japan Institute of Electronics Packaging

Link

https://www.jstage.jst.go.jp/article/jiepeng/8/1/8_127/_pdf

Reference32 articles.

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2. [2] Y. Shimada, "Advanced Packaging Technology Trend and Future Prospects (in Japanese)," The Institute of Electronics, Information and Communication Engineers (C), Vol. J88-C, No. 11, pp. 827-838, 2005.

3. [3] M. Mizukoshi, "Newest Flip Chip Bonding Technology (in Japanese)," Journal of The Japan Institute of Electronics Packaging, Vol. 10, No. 5, pp. 415-422, 2007.

4. [4] R. Haruta, "Packaging Technology Trend (in Japanese)," Journal of The Japan Institute of Electronics Packaging, Vol. 10, No. 5, pp. 353-357, 2007.

5. [5] T. Sasaki, H. Ueda and H. Miura, "Measurement of Local Two Dimensional Stress Distribution in a Flip Chip Structure by Using Strain Sensor Chips with 2 μm Long Piezoresistance Gauges (in Japanese)," Journal of The Japan Institute of Electronics Packaging, Vol. 12, No. 7, pp. 623-628, 2009.

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