1. [1] K. Hisano, H. Iwasaki, M. Ishizuka, and S. Makita, "Thermal Analysis of Compact Electronic Equipments (1st Report, Thermal Analysis of Notebook PC)," Transactions of the Japan Society of Mechanical Engineers Series B, Vol. 62, No. 601, pp. 3453-3458, September 1996.
2. [2] K. Hisano, H. Iwasaki, M. Ishizuka, and S. Makita, "Thermal Analysis of Compact Electronic Equipments (2nd Report, Thermal Analysis of Portable Computer with Cooling Fan)," Transactions of the Japan Society of Mechanical Engineers Series B, Vol. 64, No. 628, pp. 4179-4184, December 1998.
3. [3] S. Ohashi and M. Honma, "Evaluation Method for Natural Air Cooling Performance of Notebook Size Electronic Equipment," Transactions of the Japan Society of Mechanical Engineers Series B, Vol. 63, No. 616, pp. 4043-4049, December 1997.
4. [4] T. Kobayashi, T. Ogushi, N. Sumi, and M. Fujii, "Thermal Design of a Slim Notebook Personal Computer," Transactions of the Japan Society of Mechanical Engineers Series B, Vol. 64, No. 628, pp. 4185-4192, December 1998.
5. [5] M. Ishizuka and Y. Fukuoka, "Transient Temperature Rise for Multi-Chip Packages," Transactions of the Japan Society of Mechanical Engineers Series B, Vol. 52, No. 476, pp. 1772-1776, April 1986.