Relationship between Copper Patterns and Temperature Rise of Printed Circuit Board for Small Surface Mount Electronic Components in Terms of Constriction Thermal Resistance-Reference-Cited by-同舟云学术

Relationship between Copper Patterns and Temperature Rise of Printed Circuit Board for Small Surface Mount Electronic Components in Terms of Constriction Thermal Resistance

Published:2017 Issue:0 Volume:10 Page:E16-012-1-E16-02-10
ISSN:1883-3365
Container-title:Transactions of The Japan Institute of Electronics Packaging
language:en
Short-container-title:Transactions of The Japan Institute of Electronics Packaging

Author:

Aruga Yoshinori¹,Hirasawa Koichi¹,Aoki Hirotoshi¹,Hatakeyama Tomoyuki²,Nakagawa Shinji²,Ishizuka Masaru²

Affiliation:

1. KOA CORPORATION

2. Toyama Prefectural University

Publisher

Japan Institute of Electronics Packaging

Link

https://www.jstage.jst.go.jp/article/jiepeng/10/0/10_E16-012-1/_pdf

Reference11 articles.

1. [1] International Electrotechnical Commission, IEC60115-1:2008, Fixed resistors for use in electronic equipment - Part 1: Generic specification.

2. [2] Technical Standardization Committee, Technical Standardization Working Group on Passive Components, "Study for the derating curve of fixed surface mount resistors," Japan Electronics and Information Technology Industries Association, 2014, JEITA RCR-2114 (in Japanese).

3. [3] M. Ishizuka, "Netsu sekkei gijutsu kaiseki hand book (Thermal design technology and analysis hand book)," pp. 400-403, Mimatsu Co. ltd, 2008.

4. [4] W. Nakayama, R. Matsuki, Y. Hacho, and K. Yajima, "A New Role of CFD Simulation in Thermal Design of Compact Electronic Equipment: Application of the Build-up Approach to Thermal Analysis of a Benchmark Model," Journal of Electronic Packaging, Vol. 126, pp. 441-448, 2004.

5. [5] H. Yoshino, X. Zhang, and M. Fujii, "Numerical Simulations for Conjugate Heat Transfer from Heat Sources Mounted on a Conductive Wall," 15th Computational Mechanics Division Conference, 2002.