Investigation of Microprocessor Heat Conduction Paths by Utilizing One-Dimensional Thermal Network
Author:
Affiliation:
1. AMD Japan Ltd.
2. Department of Mechanical System Engineering, Toyama Prefectural University
3. Toyama Prefectural University
Publisher
Japan Institute of Electronics Packaging
Subject
Electrical and Electronic Engineering
Link
https://www.jstage.jst.go.jp/article/jiep/18/3/18_167/_pdf
Reference5 articles.
1. 3) K. Nishi, T. Hatakeyama, and M. Ishizuka: “Steady and Transient Heat Transfer Analysis of The Microprocessor System Using One-Dimensional Thermal Network,” InterPACK2013, IPACK2013-73052, 2013
2. 4) JEDEC Solid State Technology Association: “Two-Resistor Compact Thermal Model Guideline,” JESD15-3, JEDEC Standard, July 2008
3. 5) S. Lee, S. Song, and V. Au: “Constriction/Spreading Resistance Model for Electronics Packaging,” Proceedings of the ASME-JSME Thermal Engineering Joint Conference, Vol. 4, pp. 199-206, 1995
4. 7) K. Nishi, T. Hatakeyama, S. Nakagawa, and M. Ishizuka: “Transient Heat Transfer of The Microprocessor System Investigation regarding Natural Convection with Slate Style Chassis,” Transactions of The Japan Institute of Electronics Packaging, Vol. 6, No. 1, pp. 70-77, 2013
5. 8) Y. S. Muzychka, J. R. Culham, and M. M. Yovanovich: “Thermal Spreading Resistance of Eccentric Heat Sources on Rectangular Flux Channels,” Journal of Electronic Packaging, Vol. 125, pp. 178-185, 2003
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