Investigation of Formation and Growth Behavior of Cu/Al Intermetallic Compounds during Isothermal Aging
Author:
Affiliation:
1. Joining and Welding Research Institute, Osaka University
2. Production and Technology Unit, Renesas Electronics Corporation
Publisher
Japan Institute of Electronics Packaging
Link
https://www.jstage.jst.go.jp/article/jiepeng/7/1/7_1/_pdf
Reference14 articles.
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3. [3] H. Xu, C. Liu, V. V. Silberschmidt, and Z. Chen, "Growth of intermetallic compounds in thermosonic copper wire bonding on aluminum metallization," Journal of Electronic Materials, Vol. 39, No. 1, pp. 124-131, 2010.
4. [4] C. J. Hang, C. Q. Wang, M. Mayer, Y. H. Tian, Y. Zhou, and H. H. Wang, "Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging," Microelectronics Reliability, Vol. 48, No. 3, pp. 416-424, 2008.
5. [5] H. Xu, C. Liu, V. V. Silberschmidt, S. S. Pramana, T. J. White, Z. Chen, and V. L. Acoff, "Behavior of aluminum oxide, intermetallics and voids in Cu-Al wire bonds," Acta Materialia, Vol. 59, No. 14, pp. 5661-5673, 2011.
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