Effect of Sb Addition on Electromigration in Solder Joints-Reference-Cited by-同舟云学术

Effect of Sb Addition on Electromigration in Solder Joints

Published:2021-09-01 Issue:6 Volume:24 Page:606-613
ISSN:1343-9677
Container-title:Journal of The Japan Institute of Electronics Packaging
language:en
Short-container-title:Journal of Japan Institute of Electronics Packaging

Author:

Yamanaka Kimihiro¹,Kondo Naoki¹,Mizutori Hiiro¹

Affiliation:

1. Department of Electrical and Electronic Engineering, School of Engineering, Chukyo University

Publisher

Japan Institute of Electronics Packaging

Subject

Electrical and Electronic Engineering

Link

https://www.jstage.jst.go.jp/article/jiep/24/6/24_JIEP-D-21-00019/_pdf

Reference19 articles.

1. 1) K. N. Tu: "Recent Advances on Electromigration in Very-Large-Scale-Integration of Interconnects," Journal of Applied Physics, Vol. 94, pp. 5451–5473, July 2003

2. 2) T. Kadoguchi, K. Gotou, K. Yamanaka, S. Nagao, and K. Suganuma: "Electromigration Behavior in Cu/Ni–P/Sn–Cu Based Joint System with Low Current Density," Microelectronics Reliability, Vol. 55, No. 12, pp. 2554–2559, December 2015

3. 3) M. Koide, K. Fukuzono, M. Watanabe, and S. Sakuyama: "CPU Package Technologies for High Performace Server," Proceedings of The 26th Symposium on Microjoining and Assembly Technology in Electronics, pp. 167–170, January 2020

4. 4) N. Take, T. Kadoguchi, M. Noguchi, and K. Yamanaka: "Electromigration of Ni Plating/Sn-0.7Cu Based Joint System of Power Modules for Hybrid Vehicles," SAE Technical Paper 2017-01-1239, doi:10.4271/2017-01-1239, March 2017

5. 5) T. Sakai, E. Watanabe, T. Sei, and K. Yamanaka: "Solder Electromigration Failure Time as a Function of The Angle between The c-axis of Sn Crystals and Direction of Electron Flow," Proceedings of 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), pp. 102–107, doi:10.23919/ICEP.2018.8374680, June 2018

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