Author:
Sakai T.,Watanabe E.,Sei T.,Yamanaka K.
Cited by
5 articles.
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1. パワーモジュールにおけるはんだ接合部の交流電流によるエレクトロマイグレーション;Journal of The Japan Institute of Electronics Packaging;2023-09-01
2. Electromigration in Solder Joints Using Sn-3.0Cu Solder in Power Modules;Journal of The Japan Institute of Electronics Packaging;2023-01-01
3. Effect of Sb Addition on Electromigration in Solder Joints;Journal of The Japan Institute of Electronics Packaging;2021-09-01
4. Electromigration in Solder Joints;Journal of The Japan Institute of Electronics Packaging;2020-05-01
5. Current Status and Issues of the Reliability Engineering;Journal of The Japan Institute of Electronics Packaging;2020-01-01