Electromigration in Solder Joints Using Sn-3.0Cu Solder in Power Modules
Author:
Affiliation:
1. Department of Electrical and Electronic Engineering, School of Engineering, Chukyo University
Publisher
Japan Institute of Electronics Packaging
Subject
Electrical and Electronic Engineering
Link
https://www.jstage.jst.go.jp/article/jiep/26/1/26_JIEP-D-22-00019/_pdf
Reference19 articles.
1. 1) T. Kadoguchi, K. Gotou, K. Yamanaka, S. Nagao, and K. Suganuma: "Electromigration Behavior in Cu/Ni–P/Sn–Cu Based Joint System with Low Current Density," Microelectronics Reliability, Vol. 55, No. 12, pp. 2554–2559, December 2015
2. 2) N. Take, T. Kadoguchi, M. Noguchi, and K. Yamanaka: "Electromigration of Ni Plating/Sn-0.7Cu Based Joint System of Power Modules for Hybrid Vehicles," SAE Technical Paper 2017-01-1239, doi:10.4271/2017-01-1239, March 2017
3. 3) K. N. Tu: "Recent Advances on Electromigration in Very-Large-Scale-Integration of Interconnects," Journal of Applied Physics, Vol. 94, pp. 5451–5473, July 2003
4. 4) J. R. Black: "Electromigration - A Brief Survey and Some Recent Results," IEEE Transactions on Electron Devices, Vol. 16, No. 4, pp. 338–347, April 1969
5. 5) J. R. Black: "Physics of Electromigration," Proceedings of 12th International Reliability Physics Symposium, pp. 142–149, April 1974
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