1. 2) http://ja.wikipedia.org/wiki/PowerPC
2. 3) Y. Tsukada, Y. Maeda, and K.Yamanaka: “A Novel Solution for MCM-L Utilizing Surface Laminar Circuit and Flip Chip Attach Technology,” Proceedings of IEPS/ISHM 2nd International Conference and Exhibition on Multichip Modules, pp. 252-255, 1993
3. 4) Y. Tsukada, Y. Mashimoto, and N. Watanuki: “A Novel Chip Replacement Method for Encapsulated Flip Chip Bonding,” Proceedings of IEEE 43rd Electronics Component & Technology Conference, Vol. 1, pp. 199-204, 1993